1. Redesign according to IPC Class III
2. Redesign of PCB’s New layout
3. PCB’s component management with EOL verification
4. PCB’s Housing Re-Design (including robustness measures for thermal and
mechanical robustness optimization, EMC/ESD qualification, vibration tests according
to aviation standards).
5. PCB’s Tray Re-Design
6. Prototype Package Delivery
7. Support Supplier Selection and qualification