1. Redesign according to IPC Class III 2. Redesign of PCB’s New layout 3. PCB’s component management with EOL verification 4. PCB’s Housing Re-Design (including robustness measures for thermal and mechanical robustness optimization, EMC/ESD qualification, vibration tests according to aviation standards). 5. PCB’s Tray Re-Design 6. Prototype Package Delivery 7. Support Supplier Selection and qualification